TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0vRABi-0000XFC; Fri, 22 Nov 96 22:59 CST
Content-Type:
text/plain; charset=US-ASCII
Old-Return-Path:
Date:
Sat, 23 Nov 1996 00:08:32 -0500 (EST)
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
MIME-Version:
1.0
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/7958
TO:
[log in to unmask] (ddhillma)
Return-Path:
<TechNet-request>
X-Status:
X-Loop:
From [log in to unmask] Tue Dec 3 09:
04:33 1996
Content-Transfer-Encoding:
7bit
Resent-Message-ID:
<"U9iXM1.0.or6.rIebo"@ipc>
Subject:
From:
Karen Tellefsen <[log in to unmask]>
Cc:
In-Reply-To:
<[log in to unmask]> from "ddhillma" at Nov 22, 96 04:37:49 pm
X-Mailer:
ELM [version 2.4 PL25]
Message-Id:
Parts/Attachments:
text/plain (26 lines)
> 
>      Hi!
>      
>      The report everyone is looking for is:
>      
>      "Evaluation of Low Residue Soldering for Military and Commercial 
>      Applications: A Report from the Low-Residue Soldering Task Force", 
>      June 1995
>      
>      contact: Ron Iman, Sandia National Labs, [log in to unmask]
>
Ron Iman is no longer at Sandia.

-- 
Karen Tellefsen
[log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2