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Whomever...
We are looking at a new product to be designed/fabricated with
either IPC class 2 or class 3 requirements. Our design parameters,
which as still negotiable, are as follows:
O 14 layer, .085 thick VME type board
O 1 oz. copper (5-6 planes/8-9 signal)
O mixed tech (560 pin pgas on .1 x .05 mil staggered
pitch/299 pin pgas on .1 mil pitch/304 pin quad flat
packs on .02 mil pitch/100 pin quad flat packs on
.025 pitch, etc, etc, etc)
O .005 trace/space
O .010 nominal dia via in .025 mil pad.
What comments/criticisms/suggestions would the design/fabrication
community make to help ensure produciblity and keep the cost reasonable??
Thanks in advance.
Bob Vanech
Northrop Grumman
Norden Systems
Norwalk ct
(203) 852-4810
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