TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0vQCpu-0000UiC; Wed, 20 Nov 96 07:37 CST
Content-Type:
text/plain; charset=ISO-8859-1
Old-Return-Path:
Date:
Wed, 20 Nov 1996 07:44:47 -0600
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
MIME-Version:
1.0
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/7874
X-MSMail-Priority:
Normal
Return-Path:
<TechNet-request>
X-Status:
X-Loop:
TO:
From [log in to unmask] Wed Nov 20 08:
59:51 1996
Resent-Message-ID:
<"Yzjz63.0.enB.1cmao"@ipc>
Subject:
From:
[log in to unmask] (Dan Delargy)
Message-ID:
<19961120134503896.AAA189@vera>
Content-Transfer-Encoding:
7bit
X-Mailer:
Microsoft Internet Mail 4.70.1155
X-Priority:
3
Parts/Attachments:
text/plain (70 lines)
I would suggest using a board house that has a standard finish of LPI mask.
 Our standard finish is LPI over bare copper, so there is no extra cost
associated with this product/finish.  There are probably some other shops
out there that provide the same.

Vera Payne
Graphic Electronics Inc.
Tulsa, Ok
918-835-4417

> From: [log in to unmask]
> To: [log in to unmask]
> Subject: Unidentified subject!
> Date: Monday, November 18, 1996 2:00 PM
> 
> We recently completed a single sided FR-4 design with a large area that
we
> "poured" copper into.  Two of our three high volume board shops said no
> problem when they reviewd this design. However our third house said that
it
> there is a possibility of a problem because we use a screenable solder
mask
> and they have a worry about possible flaking of the mask on the large
copper
> area.  They recommended two ideads:
> 
>         1.  Hatch the copper pour instead of leaving it solid.
>         
> Our answer to this? (Ameritech Commercial guy) ....MMMMM.......NO.  We
need
> it there for RF and ESD reasons I can't discuss.
> 
>         2.  Hatch the solder mask every 1/8 of an inch.
> 
> Again our answer to this is .....MMMMMM.......No.  This would gobble
solder
> out of our wave machines for no good reason.
> 
> So we said how about LPI and they said sure for a significant price
> increase.  Out of the three board houses this is the one who always gives
us
> the best product at the cheapest price with the least amount of rejects.
> 
> SO WHAT DO WE DO NOW ?  We want to continue to use the solid copper pour
> feature on future products.
> 
> Your thoughts would be appreciated.
> 
>
***************************************************************************
> * TechNet mail list is provided as a service by IPC using SmartList v3.05
*
>
***************************************************************************
> * To unsubscribe from this list at any time, send a message to:          
*
> * [log in to unmask] with <subject: unsubscribe> and no text.       
*
>
***************************************************************************

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2