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1996

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From [log in to unmask] Wed Nov 20 08:
59:39 1996
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[log in to unmask] (Paul J Klouda)
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--------- Begin forwarded message ----------
From: Thermagon.pjk
To: [log in to unmask]
Subject: Etching Very Thick Copper
Date: Tue, 19 Nov 1996 14:33:39 PST
Message-ID: <[log in to unmask]>

Dear TechNetters,

I am in need of a facility(ies) that can etch copper up to .025" thick.
The images are not very dense with minimum traces @ or around .050". The
parts are single sided. Should anyone have information let me know at
TechNet or my E-mail address directly   [log in to unmask]

Thank you,

Paul Klouda
Product Manager T-lam System
--------- End forwarded message ----------

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