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Dave Hillman's reply is very good.
You also need to consider that nickel is much less soluble in tin than copper
(dissolution rate about 1/30) and thus requires more heat (higher temperature
and/or more time) to form a good solder joint. Further, such a solder joint
is typically not as strong as one made to a copper surface.
Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ 07945 USA
Phone & Fax: 201-543-2747
E-Mail: [log in to unmask]
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