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From [log in to unmask] Fri Nov 15 17: |
59:21 1996 |
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The test method described by Dave Hillman is also described in EIA-638 "Surface
Mount Solderability Test".
Tracy Tennant
Micron Technology
[log in to unmask]
Folder: READ Message# 708378
From: [log in to unmask] 15-NOV-1996 14:54:01.22
To: [log in to unmask]
CC: [log in to unmask]
Subj: Re: ASSY: BGA SOLDERABILITY
Hi Jim -
Have you ever noticed that specifications and technology just don't
track together very well! The solderability of BGA components is a
good instance of this fact. The ANSIJ-STD-002 doesn't specifically
exclude the solderability testing of BGAs but the methods don't fit
very well. One consideration is what solder sphere metallurgy do you
have - 63/37 or 90/10 solder alloy? The 90/10 would allow you to do
some solder dipping. My suggestion is to do a simulated surface mount
test - this test will be in the next revision of the 002 spec but
isn't in the current rev. The test amounts to stenciling a solder
paste deposit that matches the component footprint on a nonsolderable
substrate (PTFE, ceramic,etc), placing the component, running it
through a reflow process, cleaning and inspecting for 95% wetting.
This testing would satisfy both the solderability concerns and the
001B question. As for your oxide question - it shouldn't be any
different than other components if the solder alloy is the same. Good
Luck.
Dave Hillman
Rockwell Collins
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