Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vN2As-0000YqC; Mon, 11 Nov 96 13:37 CST |
Old-Return-Path: |
|
Date: |
Mon, 11 Nov 96 11:43:00 PST |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
Resent-Message-ID: |
<"G6oEL1.0.-sI.02uXo"@ipc> |
From [log in to unmask] Fri Nov 15 17: |
23:37 1996 |
From: |
|
Subject: |
|
X-Loop: |
|
Message-ID: |
|
Parts/Attachments: |
|
|
Lady and gentleman,
I am working on a connector project for PCB.
I am concerning about the IPC solderability requirements for
connectors on PCB, and no chemical degredation/permanent deformation
and thermal expansion coefficient for contact base metal on the PCB.
Please direct me on this.
Thank you
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|