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Here's a thought...
Can solderability be specified for BGA components?
How much oxidation would render a BGA unsolderable?
How would one test for solderability on BGAs?
How does one "... ensure that all components... are solderable at the start of
hand and/or machine soldering operations." (J-STD-001B, para 5.4) for BGAs?
Any comments?
Jim Marsico
(516) 595-5879
[log in to unmask]
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