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We are evaluating all of the techniques and methods for doing controlled
z drilling with plate thru holes. We have done a few boards like this
and
had marginal success with getting the plating solution in the air
trapped
hole.
We have tried some of the tricks that we are aware of,i.e., agitation,
vibration,
larger aspect plating ratios, and air sparging.
Does anybody out there know of any other methods that we haven't tried?
Any comments
would be appreciated.
Thank you,
Brad Reese
Cirtech Inc.
<714> 921-0860 X222
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