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| From [log in to unmask] Fri Nov 15 10: |
04:16 1996 |
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We had a customer who encountered much the same problem.
The solution that worked for them was to change from a solid
round fiducial to a "doughnut" fiducial, with an ID and an
OD. This tended to eliminate the doming of solder at the
top of the round solid fiducial. I wish that I could supply
you with more info, but I come from the fab side of boards,
not assembly, and this situation occurred a few years back.
Tom Coyle
Field Services Engineer
HADCO Corporation
P.S.: My message is cropped, so that you do not have to read
all of the other responses once again.
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