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Mon, 11 Nov 1996 09:20:16 -0500 |
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by ipc.org (Smail3.1.28.1 #2)
id m0vMsAW-0000R6C; Mon, 11 Nov 96 02:56 CST |
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| From [log in to unmask] Thu Nov 14 10: |
47:06 1996 |
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James,
This is generally not a good idea as the tin oxide layer present on the solder
is difficult to get good adhesion to and brittle. Some adhesives manufacturers
have formulated stuff specifically for this finish which seem to give good
results. Another approach I have heard of success with is to cure the adhesive
just above the reflow temp of the solder, letting the solder wet the Ag
particles,
but if you get it too hot for too long the silver dissolves in the solder & you
are back where you started.
David Whalley
At 13:26 08/11/96 PST, you wrote:
> Need help in silver epoxy bonding components to sn/pb surfaces
> 1) type of epoxy
> 2) cure temperatures and time
> 3) surface preperation
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