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by ipc.org (Smail3.1.28.1 #2)
id m0vLw31-0000SuC; Fri, 8 Nov 96 12:52 CST |
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Fri, 8 Nov 1996 12:42:06 -0500 |
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| From [log in to unmask] Fri Nov 8 13: |
25:57 1996 |
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<TechNet-request> |
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<"144iM1.0.fqC.96uWo"@ipc> |
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Is there anyone who has the experience of encapsulating SMD solder
joints to prevent CTE mismatch solder joint cracking? Thif lead pad
particularly at Alloy 42 leaded TSOPs. Also , is anyone using electrically
conducting adhesive to maintain electrical continuity if lead pad
separation should occur?
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