Both J-STD-001B (paragraph 9.2.6.1, Figure 9-4, Note 1) and MIL-STD-2000A 
(paragraph 4.23.7.5) allow solder in the upper bend on gull wing leads.  
MIL-STD-2000A even goes further by saying "Solder in the stress relief bends 
does not constitute elimination of stress relief." (Table I, defect 3).  This 
changed from MIL-STD-2000 rev - which said "The solder fillet for any lead 
shall not extend into the start of the upper bend radius." (paragraph 
4.19.5.5).

I'm assuming that the requirement (or lack of) in the J-Standard was copied 
from the MIL Standard, rev A.  When MIL-STD-2000A was generated, was there test 
data which verified that the reliability integrity of gull wing devices wasn't 
compromised when solder entered the upper bend radius?

If anyone knows why the requirement changed, or, even better, knows where I can 
get the reliability data, this would be great.  I would also like to know if 
nobody knows why the requirement changed.

Thanks...

Jim Marsico
(516) 595-5879
[log in to unmask]
		
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