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We've tried to qualify (J-STD-001A, NAWC MT-0002, or MIL-STD-2000B) a low
solids flux in a no-clean process (for hand soldered assemblies which cannot be
subjected to our in-line aqueous cleaner) with no success. It seems that the
excess flux which is not directly subjected to the heat of the soldering iron
caused the test board (IPC-B-36) to fail SIR, no matter how we tried to limit
the volume of flux deposited.
We had to revert back to RMA flux for these instances and hand clean with an
IPA blend.
Jim Marsico
(516) 595-5879
[log in to unmask]
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