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Thu, 7 Nov 1996 12:20:37 -0500 |
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| From [log in to unmask] Thu Nov 7 13: |
43:51 1996 |
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by ipc.org (Smail3.1.28.1 #2)
id m0vLXwL-0000S9C; Thu, 7 Nov 96 11:08 CST |
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Bill Hunt < [log in to unmask]>
"ASSY: Soldering process for 50 mil pitch connectors" (Nov 7, 11:23am) |
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Bill,
This sounds like a pad size / hole size problem. If I remember
correctly, we used a 22-28 hole size and a 45x55 rectangular pad. The
rectangular pad was the key to resolving our problems with the
component, (however I have forgotten just what our problems were.)
Good Luck,
George Franck
On Nov 7, 11:23am, Bill Hunt wrote:
> Subject: ASSY: Soldering process for 50 mil pitch connectors
> Has anybody had any success wave soldering 50 mil pitch through hole
> connectors? Or has anybody had any success reflow soldering a hi
> temperature 50 mil pitch connector? We have insufficient solder joints
> when the connectors are reflowed and bridging if the connector is wave
> soldered.
>
>
>
--
George Franck Jr
Raytheon E-Systems
Product Assurance Engineer
Falls Church Va
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