 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vKain-0000UGC; Mon, 4 Nov 96 19:54 CST |
| Old-Return-Path: |
|
| Date: |
Mon, 04 Nov 96 20:52:28 EST |
| Precedence: |
list |
| Resent-From: |
|
| Cc: |
|
| X-Status: |
|
| Status: |
O |
| From [log in to unmask] Tue Nov 5 08: |
52:23 1996 |
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"BmY5K.0.AF8.OvfVo"@ipc> |
| Subject: |
|
| From: |
|
| X-Mailing-List: |
|
| X-Loop: |
|
| Resent-Sender: |
|
| Message-Id: |
|
| Parts/Attachments: |
|
|
De: Coderre - JCCODERR BRMVM1
***************************************************************
CLASSIFICATION NON-CLASSIFIE ( ) CONFIDENTIEL ( )
Objet: goldfinish on PC boards
Gold is highly soluble in solder and should not affect the properties
of the solder joint if the concentration is below 3% (wt). This is
true if the gold is completely dissolved in the solder and one does not
find a rich gold concentration at the interface. THis rich zone may
occur if the temperature cycle is such that the dissolution is not
complete. This should be verified by SEM cross-sectioning
Literature references are available upon request
At higher gold concentrations (either local or bulk), embrittlement
will occur
Merci/Regards
Directeur Ingenierie MLC / MLC ENG. MGR
Dept 881/23 BRMT (tel. 514-534-6591, US tieline 552)
INTERNET ADDRESS [log in to unmask]
*** R(c)acheminement de la note de SMTP2 --IINUS1 11/04/96 15:05 ***
|
|
|
