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| From [log in to unmask] Mon Nov 4 13: |
05:56 1996 |
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Would appreciate any source for info on effects on solderjoint
reliability when assembling (solderpaste / IR Reflow ) a full gold
(approx 30 microinches thick) finished board. What are the effects of
the gold alloying with the tinlead in the joint ? / Thank you.
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