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From [log in to unmask] Mon Nov 4 10: |
01:58 1996 |
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We have an application on a 2 layer board with through hole
technology which requires an insulating material
laminated/applied to one surface/side. Initially we thought
of having a prepreg material laminated to one surface but are
unsure if this is the most cost effective method. Anyone out
there who knows of a method or material which would support
this requirement please respond.
Some of our requirements are;
>>>>>>Have you considered solder mask!!!!
1. Must be a UL recognized material
>>>>>>>>yes
2. Must provide at least 500V of dielectric insulation
>>>>>>>>>solder mask is typically 40V per micron, so to
provide 500V requires a minimum of 12.5um of resist, easily
achievable by double coating wet on dry.
3. Would preferably be thin, .001-.003 thick.
>>>>>>>>>see above
Some questions we have are;
1. What type of relief would be needed around PTH?
>>>>>>>>photoimageable = print tolerance 2. How thick would the material need to be?
>>>>>>>>see above 3. Who is doing this type of fabrication today?
>>>>>>>>everyone 4. Can it be applied selectively?
>>>>>>>>photoimage 5. What is the typical cost impact to a double sided board?
>>>>>>>>do you want % or in cents - or do you already have the
the answer and its on your board already?
Dougal Stewart
Exacta Circuits
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