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id m0tnGgR-0000E6C; Thu, 15 Feb 96 21:18 CST |
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| From [log in to unmask] Fri Feb 16 08: |
56:29 1996 |
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We currently process core boards with vias in the surface mount pads.
Parts are soldered directly over the filled vias with plating and
solder over the vias.
Roxanne Tovey
______________________________ Reply Separator _________________________________
Subject: Re: via holes & surface mount components
Author: [log in to unmask] at esdigate
Date: 2/13/96 10:39 AM
Via hole should be atleast .025 away from surface mount pads.
______________________________ Reply Separator _________________________________
Subject: via holes & surface mount components
Author: [log in to unmask] at corp
Date: 2/12/96 4:10 PM
What is the minimum distance via holes can be to surface mount components?
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