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From [log in to unmask] Mon Nov 4 09: |
50:27 1996 |
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Anyone,
We have an application on a 2 layer board with through hole
technology which requires an insulating material
laminated/applied to one surface/side. Initially we thought
of having a prepreg material laminated to one surface but are
unsure if this is the most cost effective method. Anyone out
there who knows of a method or material which would support
this requirement please respond.
Some of our requirements are;
1. Must be a UL recognized material
2. Must provide at least 500V of dielectric insulation
3. Would preferably be thin, .001-.003 thick.
Some questions we have are;
1. What type of relief would be needed around PTH?
2. How thick would the material need to be?
3. Who is doing this type of fabrication today?
4. Can it be applied selectively?
5. What is the typical cost impact to a double sided board?
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