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From: Scott Westheimer
Date: 10/27/96
I am looking for as much information on several different areas of BGA
and MCML's packaging.
I have been asked to look into the qualification process of new materials
(substrates), that can be used with these packages and to find out about
the
qualification process.
1. I would like to get some recommendations of articles or magazines that
cover these topics.
2. I would like to get information on the specifications and testing
requirements for these technologies. What spec.'s do they fall under? What
is the test procedure for qualifying a new material for these packages. Are
there several stages of testing i.e material, functional, aging?
Thank you in advance.
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