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Address,
Unless I'm missing it, IPC-SM-782 does not define how much spacing is
under the package (lead contact to package bottom). I need to add a
0603 or 0805 chip resistor underneath a PLCC-44 for a minor revision
change.
Question:
Is it possible to add a 0603/0805 with a .016/.024 package height,
respectively under a PLCC-44?
Has anyone done this and acheived a reasonable solder paste flow under
the package or did the PLCC-44 rob the passive devices of heat?
I think the PLCC-44 may crush (crack) the underlying devices in
assembly unless there is enough height?
Please advise.
John Gulley
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