 
| Mime-Version: |
1.0 |
| Content-Type: |
text/plain; charset="ISO-8859-1"; Name="Message Body" |
| Old-Return-Path: |
|
| Date: |
28 Oct 1996 15:46:49 -0500 |
| Precedence: |
list |
| Resent-From: |
|
| From [log in to unmask] Mon Oct 28 18: |
11:19 1996 |
| Resent-Sender: |
|
| Content-Transfer-Encoding: |
quoted-printable |
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| X-Status: |
|
| Resent-Message-ID: |
<"_LmZ73.0.dD8.E-GTo"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vHxlu-0000S2C; Mon, 28 Oct 96 13:54 CST |
| X-Mailer: |
Mail*Link SMTP-QM 3.0.2 |
| Message-ID: |
|
| Parts/Attachments: |
|
|
Subject: Time: 2:31 PM
OFFICE MEMO Various Questions Date: 10/28/96
Looking to find justification (rather than just the shall from J-STD-001A) against hand lead forming on thru hole DIPs. Something along the lines of a case study.
Looking to find a means to quantify the cleanliness of PCB assembly with washless flux. ie. am I putting to much flux on, is the flux contaminated etc. Having problems with a board that when parts are removed from sockets and washed with alcohol, they mysteriously start to work, leading to speculation that the flux is the problem. Flux, board house, and board have not changed for years. Touchup on boards is minimal.
Any help is greatly appreciated.
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
