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| From [log in to unmask] Mon Oct 28 08: |
50:16 1996 |
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What is the detrimental effects over different periods of time on the
solderability of HASL PCBs due to uncontrolled humidity and temperature.
I have seen 5/10 Micron plating reduced to 0.8 Micron due to bad storeage.
What is the effects of different humidity and temperatures on the stored
PCBs after different lengths of time?
Has there been any research into this?
Any suggestions/opinions appreciated.
Thanks in advance.
Moss Dore
AMT Ireland
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