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| From [log in to unmask] Wed Feb 14 15: |
38:00 1996 |
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From: NAME: WILLIAM G KENYON
FUNC: Chemicals/Electronics
TEL: 302-652-4272 <KENYONWG AT A1 AT ESVAX>
To: NAME: [log in to unmask] <"[log in to unmask]"@ESDS01@MRGATE@ESVAX>
There was a survey done by SMT magazine in mid-94 that generated
the following data, based on the responses received.
Solder Paste: Aqueous 30%
No-clean 27%
Solvent clean 15%
Combination of all three 15%
Contract assemblers (as a group) used 84.2% aqueous solder paste.
When asked about how they were dealing with the CFC issue, 8%
said they were using an all no clean process.
This survey is almost two years old, so you may wish to make some
guesses as to growth rate on an annualized basis to get an
estimate of the range of possible usage. While this is a good
starting point, you should bear in mind that the response % is on
number of respondents, not on square meters of PWAs produced,
which would give a better picture.
-Bill Kenyon
302-652-4272/-5701 Tel/Fax
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