 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vGBhN-0000SUC; Wed, 23 Oct 96 17:22 CDT |
| Old-Return-Path: |
|
| Date: |
Wed, 23 Oct 1996 17:58:17 -0500 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| From [log in to unmask] Thu Oct 24 08: |
33:28 1996 |
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"cKoVV3.0.zJO.wgfRo"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| Message-Id: |
|
| Parts/Attachments: |
|
|
I have been trying to locate an article refernced on the Technet from
10/14 relating to plated through hole solder joint reliability
corresponding to fill and voids for different PCB thickness'. Has
anyone been successful in locating the aforementioned article or have
any information on it?
-Doug Sommer
Sperry Sun Drilling Services
[log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
