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From [log in to unmask] Wed Feb 14 11: |
59:54 1996 |
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<"BJApr.0.ikE.HbW8n"@ipc> |
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Hello --
I received this request from my home page, can any of you (all)
respond to Jeff Tan's request? Jeff's e-mail address is
[log in to unmask]
Thanks,
Ron Daniels
Editor
CA-Online
=====
Hi Ron,
This is my first visit to this page and I thought I'll try the 'tete-a-tete'.
Any way
wondering if you could direct me to any relevant information/papers on
palladium / silver-palladium / nickel-palladium plating for leadframe and
related surface-mount issues.
I think this page is a great idea. Hoping that this can be a great source of
information on semiconductor, packaging and circuit assembly on cyberspace !
regards
Jeff-MH
Senior Engineer (Process & Development)
Hewlett Packard Singapore
Integrated Circuit Business Division
Tel : (65)-662-4457
Fax : (65)-268-4842
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