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id m0vFhzK-0000S6C; Tue, 22 Oct 96 09:39 CDT |
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| From [log in to unmask] Wed Oct 23 15: |
11:45 1996 |
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<"k1Bvb2.0.neO.HoDRo"@ipc> |
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Good Day TechNetters!
What experience can you all share about forming through-hole
DIP packages into a surface mount configuration (J-leaded?)
so that the part(s) can be mounted and reflowed during the
SMD operation?
Is there automatic equipment available to form the DIP
leads? If so, who are the manufacturers and what would be a
ballpark cost?
Has reliability testing been done to validate solder joint
integrity?
Is anyone using pick & place equipment to automatically
place the newly formed part(s)?
Ron Hollandsworth
[log in to unmask]
ITT A/CD
Fort Wayne, Indiana
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