TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0vFN8S-0000VpC; Mon, 21 Oct 96 11:23 CDT
Content-Type:
TEXT/PLAIN; charset=US-ASCII
Old-Return-Path:
Date:
Mon, 21 Oct 1996 11:54:46 +0400 (EDT)
Precedence:
list
Resent-From:
Message-ID:
MIME-Version:
1.0
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/7023
TO:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"qbPFI2.0.3EH.JDwQo"@ipc>
Subject:
From:
X-Status:
From [log in to unmask] Wed Oct 23 14:
53:30 1996
X-Loop:
Resent-Sender:
TechNet-request [log in to unmask]
Parts/Attachments:
TEXT/PLAIN (23 lines)
This morning, I was looking at some boards that had pads covered with 
copper bumps, blisters, pimples, or whatever you want to call them.  I've 
been told this was a product of copper "burning", resulting when boards 
are plated with current too high.  Is this burnt copper unacceptable?  I 
didn't see any pictures in IPC-A-600 to suggest it wasn't, but don't like 
the looks of the plating.  Any comments?  Thoughts from assemblers would 
be welcome, too.
Lou Hart 
Compunetics Quality Assurance
412-858-6117


.

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2