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| From [log in to unmask] Wed Feb 14 11: |
45:43 1996 |
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<"gFcze3.0.qc6.NvI8n"@ipc> |
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I have a backplane customer who is pushing signal speeds into far
horizon. (800 Mhz - 1 Ghz) We have looked into thermalset resins
that will help accomplish this. One of the possibilities was on
Cyanate Ester. After inquiring into assembly, we had some negative
feedback that the CE would fracture greatly around the press fit
pins. I know that CE is (in fact) more brittle than epoxy but so
is polyimide. Has anyone out there had experience with press fit
pins and CE PWA's?
Groovy
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