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We are noticing a film on our SMT solder joints. It doesn't seem to
affect ionic cleanliness or conformal coating adherence, but can only
be removed mechanically with a brush or Q-tip. It has a slightly
yellowish color in most cases and appears powdery. Is this
contamination from the PWB pads or part leads floating to the top, or
a compound derived from the solder paste (63/37 RMA)? Any insight
into what this contamination is would be appreciated.
Thanks.
Ed Knowles
Lockheed Martin Astronautics
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