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| From [log in to unmask] Tue Oct 15 09: |
41:08 1996 |
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<"JQ_IV.0.8_N.7ikOo"@ipc> |
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Brian Wada
Solectron [log in to unmask]
Does anyone recall the article sometime back in the 80's or later on Plated
Through Hole Solder Quality pertaining to solder fill with leads or voids
with leads correlated to solder joint reliability. NASA or Aerojet may be
the author. Printed wiring boards are increasing in thickness greater than
.092 inches and the question of whether solder fill or lead to pth wall
solder joint affects or impacts reliablity.
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