X400-Content-Type: |
P2-1988 ( 22 ) |
Old-Return-Path: |
|
Date: |
11 Oct 96 16:39:03 -0500 |
Precedence: |
list |
Resent-From: |
|
Conversion: |
Allowed |
Disclose-Recipients: |
Prohibited |
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
Priority: |
non-urgent |
X-Loop: |
|
Content-Return: |
Allowed |
X-Mailing-List: |
|
TO: |
|
From [log in to unmask] Tue Oct 15 08: |
46:14 1996 |
Return-Path: |
<TechNet-request> |
Message-Id: |
<011CD325EBE77004*/c=us/admd=cwmail/prmd=carrier/o=syracuse/ou=ccmail1/s=Parr/g=Aric/@MHS> |
X400-Recipients: |
non-disclosure; |
Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vCvtj-0000cJC; Mon, 14 Oct 96 17:54 CDT |
X400-Originator: |
|
Resent-Message-ID: |
<"tfef_2.0.1X8.7IiOo"@ipc> |
Subject: |
|
From: |
|
Alternate-Recipient: |
Allowed |
X400-Received: |
by /c=us/admd=cwmail/; Relayed; 11 Oct 96 16:39:03 -0500
by mta MTAwltk in /c=us/admd=cwmail/; Relayed;
11 Oct 96 16:39:03 -0500 |
Content-Identifier: |
011CD325EBE77004 |
X400-Mts-Identifier: |
[/c=us/admd=cwmail/; 011CD325EBE77004-MTAwltk] |
Parts/Attachments: |
|
|
expect problems only if you use a rosin based paste and water from the
flux comes in direct contact with rosin.
Do not use liquid "no-clean" at hand solder unless it is RMA. Most no
cleans are no clean due to evaporation of all ingredients at the wave.
If this does not happen, expect field problems unless the panels are
cleaned.
You are looking for a specific paste/flux reaction.
Aric parr
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: Subj: Flux Compatibility Questions
Author: [log in to unmask] at internet
Date: 10/10/96 1:25 PM
Those of you using a no-clean/low-residue soldering solution
in your manufacturing operations, I have some questions
concerning flux compatibility.
What problems have you encountered between no-clean paste,
liquid flux at wave solder and benchtop soldering no-clean
flux(hand soldering)? I am strongly considering a water
based no-clean for wave solder to try to reduce VOCs
contribution at this facility. Will this direction limit
the flexibility of the SMD area to choose their no-clean
paste, or, perhaps the hand soldering side be limited in
their flux selection? I would appreciate some feedback and
thanks in advance.
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|