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| From [log in to unmask] Thu Oct 10 17: |
28:43 1996 |
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10-Oct-1996 14:07:09 -0700; at NGM1.Trimble |
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Juanita.
Could you(anyone) share the pad geometries for Caps or Rs that you use
when components get smaller.
And what type of paste and stencil size you use to keep enough paste in
the other bigger components?
I have found that you cannot cut stencil thickness without loosing solder
paste in filets on bigger parts. Also, if the pad size is too big I get
solder balls.
Any suggesting out there?
Thank you
Alex Basauri
[log in to unmask]
Trimble Navigation LTD
The GPS Solution!!
645 N. Mary Avenue B6
Sunnyvale, CA 94086
(408) 481-8751
(408) 481-6077 Fx
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