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by ipc.org (Smail3.1.28.1 #2)
id m0vB1sz-0000QPC; Wed, 9 Oct 96 11:53 CDT |
| From [log in to unmask] Wed Oct 9 14: |
04:28 1996 |
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Wed, 9 Oct 1996 09:42:00 -0700 |
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Is there any research on finished via structure and the integrety of
the connection; specifically tented or plugged vias vs. non-tented
vias (lpi solder mask) filled with solder.
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