Hello TechNetters!
     
     My question is similar to the BGA Socket questions with 
     a twist:
     
     I have several Circuit Cards that will utilize BGAs in 
     volume production.  My problem is that the actual BGA 
     components/packages delivery dates are lagging behind 
     the rest of the assembly.  During this development 
     phase I need to test out the functionality of the 
     Circuit Cards via an Emulator Card/Adapter.  I am in 
     the process of designing these Emulator Cards/Adapters 
     but need a method of attaching this Card to the BGA 
     land pattern.  It is not necessary to remove this 
     attachment from the BGA pattern once assembled.  This 
     attachment method does not have to meet any long-term 
     reliability for it is just to prove out the other 
     circuitry on the CCA in advance of the BGA packages 
     being received.  
     
     Thanks in advance for any help.
     
     Harlan
     [log in to unmask] 

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