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From [log in to unmask] Thu Oct 3 13: |
29:28 1996 |
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The problem can be resolved by reducing the belt speed dramatically, if using N2
atmosphere. The flux may not be breaking down the coating before becoming
liquidous. The flux may also need to be changed as there are some pastes that
are not compatible with Entek!
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______________________________ Reply Separator _________________________________
Subject: BGA defects
Author: [log in to unmask] at ftl03
Date: 10/2/96 7:12 PM
We are experiencing a problem with SMT assembly of CBGA modules onto Entek
boards. On about 1% of the boards (a significant number at our volumes),
solder from one or more of the pads does not wet the pad during reflow but
wicks up onto the ball, creating an open. The defects appear to be randomly
located and are only noticeable when we use no-clean solder paste. Previous
studies have indicated that our oven profile is not the problem.
Does anyone have experience with this kind of problem? Any ideas would be
greatly appreciated.
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