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id m0v8EVj-00005OC; Tue, 1 Oct 96 18:45 CDT |
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Tue, 1 Oct 1996 19:54:27 -0400 |
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| From [log in to unmask] Wed Oct 2 08: |
51:55 1996 |
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Jim,
More info is needed. Is there any cracked copper after solder shock in the
holes? This is the highest stress point for plated copper, far higher than
any surface stress point.
Are the surface cracks present before LPI application?
Could these cracks possibly be plating folds? This could be a low current
density area which is susceptible to folded plating. Some plating folds look
exactly like cracks, though I have seen this mostly within the PTH.
Dave Sullivan ([log in to unmask])
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