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by ipc.org (Smail3.1.28.1 #2)
id m0tm1Ox-0000CAC; Mon, 12 Feb 96 10:46 CST |
From [log in to unmask] Tue Feb 13 11: |
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At 05:39 PM 2/7/96 -0600, you wrote:
>Saw a reference on the Web to this book:
>
>Design Guidelines for Surface Mount & Fine-Pitch Technology
>
> Title: Design Guidelines for Surface Mount & Fine-Pitch Technology
>
> Author: Vern Solberg
>
> Publisher: McGraw-Hill Company
>
> Info: Pubished 1996: 260 pages. ISBN 0-07-059577-1
>
> CHAPTERS
> 1: Planning for Surface Mount Design
> 2: Component Selection for SMT
> 3: Land Pattern Development for SMT
> 4: Space Planning and Interface
> 5: Layout Guidelines for Rigid Circuits
> 6: SMT Layout and Guidelines for FLexible Circuits
> 7: Design Requirements for Fine-Pitch Devices
> 8: Providing for Test Automation
> 9: Specifying Substrate Materials and Fabrication Options
> 10: SMT Assembly Process
> 11: Aqueous Cleaning for Surface Mount Assemblies: Elimination
> of CFC Materials from the SMT Manufacturing Environment
> 12: Design Evaluation for Efficient Assembly Processing
>
>
>Looks interesting, but has anyone seen this, is it reasonably well done?
>Not that I doubt it...
>
>regards,
>
>Jerry Cupples
>Interphase Corporation
>Dallas, TX
>http://www.iphase.com
>
>
>
>
Jerry,
Vern Solberg, chairs the IPC-SM-782 committee. I have seen sections of his
book and it contains some very valuable information. It is done fairly well,
I don't think you will be disappointed.
Regards,
Gary Ferrari
Tech Circuits
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