 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0v68Z5-0000PiC; Thu, 26 Sep 96 00:00 CDT |
| Lines: |
28 |
| Old-Return-Path: |
|
| Date: |
25 Sep 96 19:57:19 -800 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| MIME-Version: |
1.0 |
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| X-Status: |
|
| X-Loop: |
|
| Resent-Message-ID: |
<"_pc-n1.0.I08.-tWIo"@ipc> |
| From [log in to unmask] Thu Sep 26 13: |
21:21 1996 |
| Content-type: |
text/plain; charset=us-ascii |
| Subject: |
|
| From: |
|
| Content-transfer-encoding: |
7bit |
| In-Reply-To: |
|
| X-Mailer: |
THOR 2.3 (Amiga;TCP/IP) |
| Message-ID: |
|
| Parts/Attachments: |
|
|
>Greetings !
>The Fab house that we use has recently asked us if they could
>use a black oxide treatment on external layers of our designs.
>I know that this process is used for internal layers but I want
>to know if any of you have used it for external layers ? Their
>reason for using it is " To create better adhesion for the
>solder mask and eliminate potential slivers ". To me, this
>sounds more like a process problem. What do you think ?
>To recap, do any of you use a black oxide coating on outer
>layers ? If so,
> why ?. If not, why not ?
I've used oxide on outers in the past for adhesion. Shouldn't
hurt anything although the thickness should be reduced to a half
or less. "Eliminate potential slivers" sounds like an etching
problem. Is thier work ok in general? Is this a difficult mask
design?
[log in to unmask]
Hallmark Circuits Inc.,
San Diego
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
