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From [log in to unmask] Wed Sep 25 19: |
07:45 1996 |
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Lou,
IBM specified an adhesion promoter (like b. oxide) under
soldermask for years...not sure if they still do.
marko
Greetings !
The Fab house that we use has recently asked us if they could use a black
oxide treatment on external layers of our designs. I know that this process
is used for internal layers but I want to know if any of you have used it
for external layers ? Their reason for using it is " To create better
adhesion for the solder mask and eliminate potential slivers ". To me, this
sounds more like a process problem. What do you think ?
To recap, do any of you use a black oxide coating on outer layers ? If so,
why ?. If not, why not ?
Thanks in advance for your help !
Lou Takach
Union Switch & Signal Inc.
412.688.2574 (voice)
412.688.2399 (fax)
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