Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0v5ueP-0000PiC; Wed, 25 Sep 96 09:09 CDT |
Content-Type: |
TEXT/PLAIN; charset=US-ASCII |
Old-Return-Path: |
<bergda> |
Date: |
Wed, 25 Sep 1996 09:09:15 -0500 (CDT) |
Precedence: |
list |
Resent-From: |
|
cc: |
|
MIME-Version: |
1.0 |
Status: |
O |
X-Mailing-List: |
|
From [log in to unmask] Wed Sep 25 14: |
12:30 1996 |
TO: |
|
Return-Path: |
<TechNet-request> |
X-Status: |
|
Resent-Message-ID: |
<"46Q_53.0.aVA.GqJIo"@ipc> |
Subject: |
|
From: |
|
X-Loop: |
|
In-Reply-To: |
|
Message-ID: |
<Pine.3.89.9609250915.C90141-0100000@ipc> |
Resent-Sender: |
|
Parts/Attachments: |
|
|
IPC-RB-276 does not require thickness measurement for fused tin-lead
plating or HASL coating. Solderability requirements are the only issue
addressed. If you have major planarity problems, you may want to
consider alternative platings/finishes. I have heard of some companies
delivering very thin unfused tin-lead for some customers trying to deal
with the flatness issue.
Regards
Dave Bergman, IPC
On 25 Sep 1996 [log in to unmask] wrote:
> Does anybody know what is the tin-lead HASL plating thickness requirements
> for printed circuit boards? Do you have any standards which specified it?
> IPC-A-600D specified only the minimum plating thickness, which is 0.005mm
> or 0.0002" for our application.
> We are having a problem with the circuit board which plating thickens is
> greater than the other ones. Also, the plating surface is not flat.
> This is not the fine pitch components board. But, when pads are so
> "bumpy" and plating is thicker than other boards, the adhesive dots
> application becomes difficult. Glue dispenser shall be adjusted for the
> proper adhesive dots size.
> It would be greatly appreciated if anyone could give me any directions.
>
>
>
>
> ***************************************************************************
> * TechNet mail list is provided as a service by IPC using SmartList v3.05 *
> ***************************************************************************
> * To unsubscribe from this list at any time, send a message to: *
> * [log in to unmask] with <subject: unsubscribe> and no text. *
> ***************************************************************************
>
>
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|