TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Content-Type:
text/plain; charset=US-ASCII
Old-Return-Path:
Date:
Wed, 25 Sep 96 0:28:18 EDT
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/6440
TO:
Return-Path:
<TechNet-request>
X-Loop:
Resent-Message-ID:
<"ZQ_Lg.0.bAL.81JIo"@ipc>
Subject:
From:
<[log in to unmask]> (James Kenny)
Received:
by ipc.org (Smail3.1.28.1 #2) id m0v5tnd-0000QBC; Wed, 25 Sep 96 08:14 CDT
X-Priority:
3 (Normal)
Message-Id:
From [log in to unmask] Wed Sep 25 13:
00:17 1996
Parts/Attachments:
text/plain (59 lines)
Perhaps HASL is not the surface finish that should be used in your assembly 
process? HASL is not a plated finish so there will be wide variations in the 
coating thickness. Electroless Nickel / Immersion Gold or organic coatings 
will always have the best surface uniformity.





[log in to unmask] Wrote:
| 
| Does anybody know what is the tin-lead HASL plating 
| thickness requirements 
| for printed circuit boards?   Do you have any standards 
| which specified it? 
|  IPC-A-600D specified only the minimum plating thickness,  
| which is 0.005mm 
| or 0.0002" for our application.
| We are having a problem with  the circuit board which 
| plating thickens is 
| greater than the other ones.   Also,  the plating surface 
| is not  flat.  
| This is not the fine pitch components board.  But,  when 
| pads are so 
| "bumpy" and plating is thicker than other boards,  the 
| adhesive dots 
| application  becomes difficult.   Glue dispenser shall be 
| adjusted for the 
| proper adhesive dots size.
| It would be greatly appreciated if anyone could give me 
| any directions.
| 
| 
|  
| 
| **********************************************************
| *****************
| * TechNet mail list is provided as a service by IPC using 
| SmartList v3.05 *
| **********************************************************
| *****************
| * To unsubscribe from this list at any time, send a 
| message to:           *
| * [log in to unmask] with <subject: unsubscribe> and 
| no text.        *
| **********************************************************
| *****************
| 
| 

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2