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| From [log in to unmask] Wed Sep 25 08: |
33:58 1996 |
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Hello Steve Holen,
The bad solder joint reliability with TSOP and Alloy 42 leadframes is indeed
an issue. It also seems difficult to have an influence on the vendors to
change lead frame material to copper. We have to use what we get!?
Have you looked at other solutions to improve solder joint reliability
(with Alloy 42 leadframes) but still using the standard FR4 material/build
ups? (tough solder, epoxi dispensing of the leads, underfill, pkg
encapsulation).
Hans Bogren
PBA technologies
Ericsson Telecom AB
Sweden
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