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54:56 1996 |
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Jim:We had a similar problem with Dynachem HG 2 mil a few years back.
The film was lifting along the edges in acid copper.Based on
cross section analysis of the lifted areas it appeared to be
occuring towards the end of the copper plating cycle.This was
then subsequently overplated with Sn/Pb etch resist.After strip
and etch the result were lines that ranged from wavy all the way
to a dead short depending on the line spacing and severity of the
lifting.
We chased this on and off for over a year looking at everything
from els.Cu surface topograhy to electroplating rack connections
and everything in between.I looked at more SEM's than I care to
remember.The good that came out of it was it helped us optimize
our resist processing operations however the problem still
remained;although to a lesser degree.
The answer for us came from a change in the pattern plate
preclean soak cleaner,too much heat,time and solvent.As a test
you can try bypassing it and seeing if the problem is reduced
or goes away,however this may be tough to catch due to the
sporadic nature of the problem.
The use of a less agressive cleaner cured the resist lift issue
for our application.A switch to LP resist didn't hurt either.
Good Luck.
Regards
Michael Barmuta
. Staff Engineer
Fluke Corp.
Everett Wa.
(206)356-6076
On Fri, 13 Sep 1996 05:24:53 -0700 Jim Moritz wrote:
> From: Jim Moritz <[log in to unmask]>
> Date: Fri, 13 Sep 1996 05:24:53 -0700
> Subject: Dry Film Breakdown
> To: [log in to unmask]
>
> We are experiencing sporadic dry film breakdown using Dynachem HG 2 mil
> film. The laminators have
> been thoroughly checked out so we don't suspect them and. The problem we
are
> seeing is what looks
> like a seeping under the film in copper plating. When the panels are
> completed the traces are
> somewhat irregular and not as crisp edged as normal. What is frustraing is
> that this happens so
> sporadically and may only affect a couple of panels out of a long run or
all
> panels in a short run.
>
> Any suggestions would be greatly appreciated.
>
> Jim Moritz
> ES&D
>
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