 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0v37PO-0000SCC; Tue, 17 Sep 96 16:10 CDT |
| From [log in to unmask] Wed Sep 18 08: |
52:08 1996 |
| Old-Return-Path: |
<TechNet-d-request> |
| Date: |
Mon, 16 Sep 1996 16:09:47 -0400 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"xKnsX1.0.UfJ.vEnFo"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| X-Mailer: |
Novell GroupWise 4.1 |
| Message-Id: |
|
| Parts/Attachments: |
|
|
I am trying to determine the solder paste height based on stencil
thickness. I have noticed that with a 7mil stencil I am getting
approximately 8mils of paste height using a metal squeegee blade
regardless of pressure settings. Is this typical of the screen printing
process??
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
