TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0v2yLB-0000PiC; Tue, 17 Sep 96 06:29 CDT
Content-Type:
text/plain; charset=ISO-8859-1
Old-Return-Path:
Date:
Tue, 17 Sep 1996 19:37:29 -0700
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
MIME-Version:
1.0
Status:
O
From [log in to unmask] Tue Sep 17 08:
37:02 1996
X-MSMail-Priority:
Normal
Return-Path:
<TechNet-request>
X-Status:
X-Loop:
X-Mailing-List:
<[log in to unmask]> archive/latest/6264
TO:
Resent-Message-ID:
<"1jXSP1.0.nXA.GkeFo"@ipc>
Subject:
From:
"Scott B. Westheimer" <[log in to unmask]>
Content-Transfer-Encoding:
7bit
X-Priority:
3
X-Mailer:
Microsoft Internet Mail 4.70.1155
Message-Id:
Parts/Attachments:
text/plain (23 lines)
From: Scott B. Westheimer
Date: 9/17/96
Subject: Entek 106

When panels are first gold plated and then S/M the pads appear OK. When the
panels are S/M and then gold plated they are tarnished around the edges.
The gold process is electrolytic. In the pass I can recall problems with
S/M residue that leaches onto the gold surface during plating that would
cause this anomaly in the plated area. How to confirm, analysis has been
done that shows carbon at different levels as you scan the pads.  Inputs
would be appreciated.

Thanks

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2