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id m0v2Ztz-0000PhC; Mon, 16 Sep 96 04:23 CDT |
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| From [log in to unmask] Mon Sep 16 09: |
39:23 1996 |
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Jim Moritz wrote:
We are looking for help to save some 4 layer boards that have a slight but
unacceptable warp. The
warp occured when the books were taken apart too soon after lamination. We
looked at the construction and the layout and ruled them out as to
contributing to the problem.
They did not have a proper cool down cycle.
Does anyone know of a way to get rid of the warpage?
These parts are 12" x 9" x .062"
Thanks again,
Jim Moritz
*******************************************************************************
Jim,
try baking the boards under weight at 140 C (above Tg) for a couple of hours
and allow to cool naturally (still under weight). This should allieviate your
warpage.
Regards
Kenny Travers
Digital
Scotland
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