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50:35 1996 |
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An important part of surface mount assembly process control is making sure
the proper amount of solder paste is deposited on the pads. The amount
deposited varies due to many factors. A few of these issues are: The PCB,
the printing parameters, and the paste characteristics. Also, the amount of
paste required to make a solder joint which meets ANSI/J-STD-001 varies from
pad to pad because of many other issues like: lead coplanarity, amount of
solder on the pad from HASL, placement accuracy, reflow
conditions,...........
I am interested in whether there is an industry standard or how others have
calculated the minimum and maximum volumes of paste required. I would
appreciate any comments on this subject.
Bill Barthel
Electronic Assembly Corporation
[log in to unmask]
(414) 751-3651
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