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We recently received some SMT components in vaccuum sealed packaging, which
included dessiccant packets, with warnings about exposure to moisture. If
the ICs were to be stored above 68% RH or if the bag was opened, the parts
were to be used within 2 or 7 days. If they were not used within that time
period they have to go thru a 24 hour cure at 125F. These are fairly simple
J lead and gull wing packs ( one of them is an LGA), but we have not seen
this warning on other SMT ICs. Is this fairly standard? Tom Moore
Tom Moore
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